This paper discusses the application of computational electromagnetics (CEM) for electromagnetic compatibility (EMC) problems of integrated circuits (ICs). It is known that the application of CEM is versatile in solving a wide range of problems. This paper focuses on the electromagnetic study of quad flat non-lead (QFN) packaged ICs, one monolithic microwave integrated circuit (MMIC) and another radio frequency integrated circuit (RFIC), from the individual chip to system in package (SiP). Full-wave electromagnetic technique is conducted in the modelling and simulation. Both chips are found producing radiated emissions in horizontal directions as omnidirectional antennas at working frequencies and then directional at resonance frequencies.
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