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A Low-Loss Patch LTCC BPF for 60 GHz System-on-Package (Sop) Applications

By Young Chul Lee and Tae Wan Kim
Progress In Electromagnetics Research Letters, Vol. 12, 183-189, 2009
doi:10.2528/PIERL09110903

Abstract

In this paper, a three-dimensional (3-D) low-loss and wideband BPF based on lowtemperature co-fired ceramic (LTCC) has been presented for 60 GHz wireless communication applications. Via pads in the vertical via transitions are designed as an additional resonator for lowloss and wide-bandwidth of the BPF. The proposed BPF has been designed by investigating its characteristics as a function of dimensions of the resonators such as a single-mode patch and via pads and also a length of feed lines are optimized for effective coupling. The designed BPF was fabricated in a 6-layer LTCC dielectric. The fabricated BPF shows a centre frequency (fc) of 61.46 GHz and a 3dB bandwidth of 10.5% from 58.2 to 64.7 GHz (6.47 GHz). An insertion loss of -2.88 dB at fc and return losses below -10 dB are achieved. Its whole size is 4.72 × 1.7 × 0.684 mm3.

Citation


Young Chul Lee and Tae Wan Kim, "A Low-Loss Patch LTCC BPF for 60 GHz System-on-Package (Sop) Applications," Progress In Electromagnetics Research Letters, Vol. 12, 183-189, 2009.
doi:10.2528/PIERL09110903
http://test.jpier.org/PIERL/pier.php?paper=09110903

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