Vol. 47

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High Frequency Electrical Characterization of 3D Signal/Ground through Silicon Vias

By Steve Adamshick, Robert Carroll, Megha Rao, Douglas La Tuplie, Seth Kruger, John Burke, and Michael Liehr
Progress In Electromagnetics Research Letters, Vol. 47, 71-75, 2014


3D integration using through-silicon-vias (TSVs) is gaining considerable attention due to its superior packaging efficiency resulting in higher functionality, improved performance and a reduction in power consumption. In order to implement 3D chip designs with TSV technology, robust TSV electrical models are required. Specifically, due to the increase of signal speeds into the gigahertz (GHz) spectrum, a high frequency electrical characterization best describes TSV behavior. In this letter, 5x50 μm TSVs are manufactured using a via-mid integration scheme and characterized using S-Parameters up to 65 GHz. At 50 GHz, the measured attenuation constant is 0.35 dB/via with a time delay of 0.7 ps/via.


Steve Adamshick, Robert Carroll, Megha Rao, Douglas La Tuplie, Seth Kruger, John Burke, and Michael Liehr, "High Frequency Electrical Characterization of 3D Signal/Ground through Silicon Vias," Progress In Electromagnetics Research Letters, Vol. 47, 71-75, 2014.


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