Power-absorbing layers on a microstrip line prepared by 3D printing are investigated in this study. Polylactic acid (PLA) with added carbon is used in the 3D printing process for the preparation of the power-absorbing layers. The S-parameters of the 3D-printed layers are measured using a vector network analyzer. The effect of the layer thicknesses on the power absorption, which enables high-frequency devices to function correctly, is discussed. As the layer thickness increases, the magnitude of S11 increases, while the magnitude of S21 decreases accordingly. The experimental results show that the power absorption is within 80-95% (sheet resistance: 75.1 Ω/□-823.76 Ω/□), in the frequency range of 2-6 GHz. In addition, simulated S-parameter analysis was performed using a high-frequency structure simulator. The simulation results are in good agreement with the experimental results.
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